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安丰伟
副教授
anfw@sustech.edu.cn

安丰伟博士,南方科技大学深港微电子学院副教授(研究员),博士生导师,深圳市海外高层次人才。2013年在日本广岛大学获得博士学位,曾担任日本广岛大学的副教授,还曾任职于日本松下半导体有限公司主管工程师,2019年3月加入南方科技大学深港微电子学院。主要从事高性能视频图像处理芯片以及高性能AI/数字信号处理芯片等领域。在集成电路设计领域顶级期刊和会议上发表了多篇学术论文(包括TCAS-I、TCAS-II、TCSVT、TVLSI、CICC、ESSCIRC、A-SSCC等)、中国发明9项中国发明专利、3项日本专利。

联系方式:anfw@sustech.edu.cn

 

教育经历

2013年,日本广岛大学,博士

2010年,日本广岛大学,硕士

2006年,青岛科技大学,学士

 

工作经历

2019.03-至今,南方科技大深港微电子学院,副教授

2018.04-2019.02,日本松下半导体有限公司,主管工程师

2017.04-2018.03,日本国立广岛大学,副教授

2013.12-2017.03,日本国立广岛大学,助理教授

2013.04-2013.11,日本国立广岛大学HiSIM研究中心,博士后

 

研究简介

图像信号处理器

视频图像处理技术

AI加速器指令及架构设计

微指令架构设计

 

所获荣誉

南方科技大学2023年度杰出教学奖

APCCAS 2022最佳论文提名奖

PrimeAsia 2022铜叶子奖

2020吴文俊人工智能科学技术奖二等奖

 

代表文章

Journal paper:

1. Ke Li; Xiwei Fang; Yunhao Ma; Wenyue Zhang; Pingcheng Dong; Zhuoyu Chen; Lei Chen; Fengwei An*, Stereo Matching Accelerator With Re-Computation Scheme and Data-Reused Pipeline for Autonomous Vehicles,  IEEE Transactions on Circuits and Systems I: Regular Papers, 2024, 71(6), PP.2760-2773

2. Yangyi Zhang; Xianglong Wang; Gang Shi; Zizhao Peng; Lei Chen; Fengwei An*, Anti-Aliasing and Anti-Color-Artifact Demosaicing for High-Resolution CMOS Image Sensor, IEEE Transactions on Circuits and Systems I: Regular Papers,2023,70(12), pp. 4928-4937

3. Gang Shi; Xianglong Wang; Yichen Ouyang; Ruoheng Yao; Zhuoyu Chen; Wei Zhang; Lei Chen; Fengwei An*, A Spatio-Temporal Video Denoising Co-Processor With Adaptive Codec, IEEE Transactions on Circuits and Systems I: Regular Papers,2023,70(11), pp.4223-4234

4. Xiao, Lanxiang;  Chen, Lei;  An, Fengwei*, An 11.6aF/kPa Mechanical Stress Sensor with 0.808% Temperature-drift Oscillator for Flip-chip Packaging, IEEE Transactions on Circuits and Systems II: Express Briefs, 2023, 70(2), pp.391-395

5. Tan, Yonghao; Deng, Huanshihong; Sun, Mengying; Zhou, Minghao; Chen, Yifei; Chen, Lei; Wang, Chao; An, Fengwei*, A Reconfigurable Coprocessor for Simultaneous Localization and Mapping Algorithms in FPGA, IEEE Transactions on Circuits and Systems II: Express Briefs, 2023, 70 (1), pp.286-290

6. Ma, Y.; Fang, X.; Guan, X.; Li, K.; Chen, L.; An, Fengwei *. Five-Direction Occlusion Filling with Five Layer Parallel Two-Stage Pipeline for Stereo Matching with Sub-Pixel Disparity Map Estimation. Sensors, 2022, 22, 8605. pp.1-17

7. Tan, Y.; Sun, M.; Deng, H.; Wu, H.; Zhou, M.; Chen, Y.; Yu, Z.; Zeng, Q.; Li, P.; Chen, L.; An, Fengwei *. A Reconfigurable Visual–Inertial Odometry Accelerated Core with High Area and Energy Efficiency for Autonomous Mobile Robots. Sensors, 2022, 22, 7669.pp.1-17

8. Dong, P., Chen, Z., Li, Z., ...Wang, C., An, Fengwei.*, Configurable Image Rectification and Disparity Refinement for Stereo Vision, IEEE Transactions on Circuits and Systems II: Express Briefs, 2022, 69(10), pp. 3973–3977

9. Yao, R., Chen, L., Dong, P., Chen, Z., An, Fengwei *, A Compact Hardware Architecture for Bilateral Filter with the Combination of Approximate Computing and Look-Up Table, IEEE Transactions on Circuits and Systems II: Express Briefs, 2022, 69(7), pp. 3324–3328

10. Yao, Ruoheng; Deng, Huanshihong; Zhang, Wengyue; Chen, Lei; An, Fengwei*, Asynchronous Double-Frame-Exposure Binocular-Camera With Pixel-Level Pipeline Architecture for High-Speed Motion Tracking, IEEE Transactions on Circuits and Systems II: Express Briefs, 2022, 69(6), pp.2967-2971

11. Luo, Y., Li, P., Shi, G., ...Chen, L., An, Fengwei *, Lane Departure Assessment via Enhanced Single Lane-Marking, Sensors, 2022, 22(5)

12. Dong, P., Chen, Z., Li, Z., ...Chen, L., An, Fengwei *, A 4.29nJ/pixel Stereo Depth Coprocessor with Pixel Level Pipeline and Region Optimized Semi-Global Matching for IoT Application, IEEE Transactions on Circuits and Systems I: Regular Papers, 2022, 69(1), pp. 334–346

13. Xu, C., Peng, Z., Hu, X., ...Chen, L., An, Fengwei *, FPGA-Based Low-Visibility Enhancement Accelerator for Video Sequence by Adaptive Histogram Equalization with Dynamic Clip-Threshold, IEEE Transactions on Circuits and Systems I: Regular Papers, 2020, 67(11), pp. 3954–3964

14. Xu, P., Xiao, Z., Wang, X., ...Wang, C., An, Fengwei *, A multi-core object detection coprocessor for multi-scale/type classification applicable to iot devices, Sensors (Switzerland), 2020, 20(21), pp. 1–13

15. Xiao, Z., Xu, P., Wang, X., Chen, L., An, Fengwei *, A Multi-Class Objects Detection Coprocessor with Dual Feature Space and Weighted Softmax, IEEE Transactions on Circuits and Systems II: Express Briefs, 2020, 67(9), pp. 1629–163

 

Conference paper:

1. Ruoheng Yao; Shengming Zhou; Zhiyue Gao; Yangyi Zhang; Yiwei Luo; Lei Chen; Fengwei An*, Live Demonstration: A Video Denoising Co-processor with Non-local Means Algorithm for FHD 30fps Image Sensor, 2024 IEEE International Symposium on Circuits and Systems (ISCAS), May. 2024

2. Zhuoyu Chen; Shengming Zhou; Pingcheng Dong; Ke Li; Wenyue Zhang; Fengwei An; Lei Chen, Live Demonstration: A 1920×1080 129fps 4.3pJ/pixel Stereo-Matching Processor for Low-power Applications, 2024 IEEE International Symposium on Circuits and Systems (ISCAS), May. 2024

3. Zhiyue Gao; Fengwei An; Lei Chen, A Non-Local Means Denoising Co-Processor with Data Reuse Scheme and Dual-Clock Domain for High Resolution Image Sensor, 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA), Oct. 2023, pp.146-147

4. Wei Zhang; Junfeng Chang; Zizhao Peng; Lei Chen; Fengwei An*, A 1920x1080 129fps 4.3pJ/pixel Stereo-Matching Processor for Pico Aerial Vehicles, 2023 IEEE 5th International Conference on Artificial Intelligence Circuits and Systems (AICAS), Jun. 2023, pp.1-2

5. Dong, Pingcheng; Chen, Zhuoyu; Li, Ke; Chen, Lei; Cheng, Kwang-Ting; An, Fengwei*, Live Demonstration: Supervised-learning-based Visual Quantification for Image Enhancement, IEEE 49th European Solid-State Circuits Conference (ESSCIRC), SEP. 2023, pp.345-348

6. Yichen Ouyang; Xianglong Wang; Gang Shi; Lei Chen; Fengwei An*, A Dynamic JPEG CODEC with Adaptive Quantization Table for Frame Storage Compression, 2022 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), Nov. 2022, pp.119-122

7. Yunhao Ma; Xiwei Fang; Pingcheng Dong; Xinyu Guan; Ke Li; Lei Chen;Fengwei An*, Subpixel Interpolation Disparity Refinement for Semi-Global Matching, 2022 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), Nov. 2022, pp.105-109

8. Ke Li; Xinyu Guan; Pingcheng Dong; Zhuoyu Chen; Lei Chen; Fengwei An*, A 320 FPS Pixel-Level Pipelined Stereo Vision Accelerator with Regional Optimization and Multi-direction Hole Filling, 2022 IEEE Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia), Nov. 2022, pp.85-88

9. Lanxiang Xiao; Lei Chen; Fengwei An*, A 14.39ppm/kPa Stress Sensor with Low Temperature-drift and High Linearity for turbulence Stress, 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA), Oct. 2022, pp.66-67

10. Zhang, Y., Peng, Z., Yao, R., ...Chen, L., An, F.*, Efficient VLSI Architecture for Edge Sensing Anti-Aliasing Demosaicing, 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021, 2021, pp. 105–106

11. Yao, R., Deng, H., Zhang, W., ...Chen, L., An, F.*, A Pseudo 943 million Frames per Rate High-Speed Camera with Asynchronous Double-Frame Exposure for Motion Estimation, 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021, 2021, pp. 103–104

12. Wang,Jipeng; Zhan,Yi; Wang,Zhaoxu; Peng,Zixuan; Xu,Jiarui; Liu,Bingqiang; Yu,Guoyi; An,Fengwei; Wang,Chao; Zou,Xuecheng, A Reconfigurable Matrix Multiplication Coprocessor with High Area and Energy Efficiency for Visual Intelligent and Autonomous Mobile Robots, Proceedings - A-SSCC 2021: IEEE Asian Solid-State Circuits Conference, 2021

13. Dong, P., Li, Z., Chen, Z., ...Wang, C., An, F.*, A 139 fps pixel-level pipelined binocular stereo vision accelerator with region-optimized semi-global matching, Proceedings - A-SSCC 2021: IEEE Asian Solid-State Circuits Conference, 2021

14. Deng, H., Dong, P., Li, Z., ...Luo, Y., An, F.*, Robot navigation based on pseudo-binocular stereo vision and linear fitting, Proceedings of 2020 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2020, 2020, pp. 174–175, 9332014