叶怀宇博士现任南方科技大学深港微电子学院副教授、博士生导师。叶博士致力于第三代半导体功率电子器件封装互联新材料开发及应用、热管理及能源管理、测试机理及应用，高功率高频率半导体器件非平衡态热力学，新型半导体传感器及封装的开发及应用，电子器件模块及系统中能源管理及可持续应用等方面的研究。

教育经历
2010年6月 – 2014年10月，荷兰代尔夫特理工大学，微系统与纳米电子研究院，工学博士

2007年9月 – 2009年10月，荷兰代尔夫特理工大学，化工及能源实验室，科学硕士

2003年9月 – 2007年6月，上海交通大学，机械与动力工程学院，工学学士

工作经历
2019年7月至今，南方科技大学 副教授，博导

2016年6月至2019年5月，重庆大学教授, 博导

2015年1月至2016年5月，半导体照明联合创新国家重点实验室研究员

2010年6月至2014年6月，荷兰应用科学院研究员、欧洲创新材料研究所研究员

所获荣誉

2011年8月获ICEPT-HDP会议杰出论文奖。

2017年11月获第三代半导体产业技术创新战略联盟（CASA）卓越创新青年。

第三代半导体产业技术创新战略联盟（CASA）2018年度联盟贡献奖。

研究简介
1、担任EuroSimE，ICEPT，SSLCHINA及IFWS国际会议学术委员会委员；宽禁带功率半导体技术蓝图(ITRW)委员会委员，曾参与欧盟重大专项 ENIAC Joint Undertaking“Consumerizing Solid State Lighting”，欧洲材料研究院（m2i）项目负责人, （2700万欧元, 21 European companies & institutes， such as Philips, CEA-Leti, Cambridge, TUDelft ）。

2、在学术领域内国际重要学术期刊和国际会议论文集上总计60余篇，其中SCI论文37篇，2篇ESI-1%高被引用论文，8篇微电子顶级杂志IEEE EDL论文，其中作为第一作者或通讯作者在《期刊引用报告》一区（JCR Q1）发表论文18篇。

3、首次在国际上提出应用于半导体研究领域的非平衡态热力学研究，连续发表文章在IEEE EDL上，审稿人评审意见为"very innovative R&D work"，同时获得关于非平衡态热力学热感研究的首个国家自然科学基金。

4、被邀请为IEEE Electric Devices Letters, IEEE Transactions on Electron Devices, Nanoscale，International Journal of Heat and Mass Transfer，Applied Thermal Engineering等10余个国际著名期刊审稿人。同时也致力于半导体器件与测试，传感器的产业化，授权专利10余项，已实现了多套设备的商业化应用，同时对863项目起到了有力的支撑作用。已经承担国内外科研项目和人才计划10余项。

代表文章
[1]Huiru Yang, Zeping Wang, Huaiyu Ye*, Kai Zhang, Xianping Chen, Guoqi Zhang, Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study, Applied Surface Science (459), 2018-11-30, 554-561. (2017 JCR Impact Factor:4.439,Q1)

[2]H Ye, FF Hu, H Tang, L Yang, X Chen*, LG Wang, G Zhang, Germanene on single layer ZnSe substrate: Novel electronic and optical properties, Physical Chemistry Chemical Physics 20 (23), 2018-05-14, 16067-16076. (2017 JCR Impact Factor:3.906,Q1)

[3]P Zhang, X Yang, W Wu, L Tian, H Cui, K Zheng, J Jiang, X Chen, H Ye*, Tunable electronic properties of silicene/GaP heterobilayer: Effects of electric field or biaxial tensile strain, Chemical Physics Letters 700, 2018-05-16, 114-121. (2017 JCR Impact Factor: 1.686,Q3)

[4]P Zhang, X Yang, W Wu, L Tian, D Xiong, H Cui, X Chen, K Zheng*, H Ye*, Two-dimensional penta-Sn 3 H 2 monolayer for nanoelectronics and photocatalytic water splitting: a first-principles study, RSC Advances 8 (21), 2018-03-16,11799-11806. (2017 JCR Impact Factor: 2.936,Q2)

[5]Lian Liu, Qun Yang, Zeping Wang, Huaiyu Ye*, Xianping Chen*, Xuejun Fan, Guoqi Zhang, High Selective Gas Detection for small molecules based on Germanium selenide monolayer, Applied Surface Science 433, 2018-03-01, 575-581.  (2017 JCR Impact Factor: 4.439, Q1)

[6]Cheng Qian, Amir Mirza Gheitaghy, Jiajie Fan, Hongyu Tang , Bo Sun, Huaiyu Ye*, Guoqi Zhang*, Thermal Management on IGBT Power Electronic Devices and Modules, IEEE Access, 6, 2018-01-02,12868-12884. (2017 JCR Impact Factor: 3.557, Q1)

[7]H Tang, H Ye*, CKY Wong, SYY Leung, J Fan, X Chen, X Fan, G Zhang*, Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component, Microelectronics Reliability 78, 2017-09-06, Vol.x, pp. 197-204. (2017 JCR Impact Factor: 1.236, Q3)

[8]Hong-Yu Tang; H.Y. Ye*; Xian-Ping Chen; Cheng Qian; Xue-Jun Fan; Guo-Qi Zhang*, Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm, IEEE Access, 2017-08-09, Vol. 5, pp. 16459 – 16468. (2017 JCR Impact Factor: 3.557, Q1)

[9]K. Zheng, Q. Yang, C. J. Tan, H.Y. Ye* and X. P. Chen*, A two-dimensional van der Waals CdS/germanene heterojunction with promising electronic and optoelectronic properties: DFT + NEGF investigations,  Physical Chemistry Chemical Physics，2017-06-26, Vol.19,  pp.18330—18337. (2017 JCR Impact Factor:3.906,Q1)

[10]H.Y. Ye*, Stanley Y. Y. Leung; Cell K. Y. Wong; Kai Lin; Xianping Chen; Jiajie Fan; Signe Kjelstrup; Xuejun Fan; Guoqi Zhang, “Thermal Inductance in GaN Devices,” IEEE Electron Device Letters, 2016-10-21, Vol. 37, pp. 1473 - 1476. (2017 JCR Impact Factor: 3.048,Q1)

[11]Fafei Hu, Hongyu Tang, Chunjian Tan, H.Y. Ye*, Xianping Chen, Guoqi Zhang, Nitrogen Dioxide Gas Sensor Based on Monolayer SnS: A First-principles Study, IEEE Electron devices letters, 2017-05-26, Vol.38, Issue 7, pp.1-4. (2017 JCR Impact Factor: 3.433,Q1)

[12]X.P. Chen, H.Y. Ye*,  Xuejun Fan, Tianling Ren, Guoqi Zhang, “A review of small heat pipes for electronics,” Applied Thermal Engineering, 2015-11-23, Vol.96, pp.1-17. (2015 JCR Impact Factor: 3.043,Q1)

[13]H.Y. Ye*, B. Li, H.Y. Tang, J. Zhao, C.A. Yuan, G.Q. Zhang, Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes, Microelectronics Reliability, 2014-06-07, Vol. 54, Issues 11, pp. 2448-55 (2014 JCR Impact Factor: 1.433,Q2)

[14]H.Y. Ye*, R. Sokolovskij, H.W. van Zeijl, A.W.J. Gielen, S.W.R. Lee, G.Q. Zhang, A Polymer Based Miniature Loop Heat Pipe with Silicon Substrate and Temperature Sensors for High Brightness Light-Emitting Diodes, Microelectronics Reliability, 2014-03-26, Vol.54, Issues 6-7, pp. 1355-62 (2014 JCR Impact Factor：1.433,Q2)

[15]H.Y. Ye*, J. Wei, H.W. van Zeijl, P.M. Sarro, G.Q. Zhang, Fabrication and Application of Temperature Triggered MEMS Switch for Active Cooling Control in Solid State Lighting System, Microelectronics Reliability, 2014-03-26, Vol. 54, Issues 6-7, pp. 1338-43(2014 JCR Impact Factor: 1.433, Q2)

[16]H.Y. Ye*, S.W. Koh, C.A. Yuan, H.W. van Zeijl, A.W.J. Gielen, S.W.R. Lee, G.Q. Zhang, Electrical-thermal-luminous-chromatic Model of Phosphor-converted White Light-Emitting Diodes, Applied Thermal Engineering, 2013-12-05, Vol. 63, Issue 2, pp.588-97. (2013 JCR Impact Factor:2.624, Q1)

[17]H.Y. Ye*, X.P. Chen, H. van Zeijl, A.W. J. Gielen, and G.Q. Zhang, “Thermal transient effect and improved junction temperature measurement method in high-voltage light-emitting diodes,” IEEE Electron Device Letters, 2013-08-06, vol. 34, pp. 1172-1174. (2013 JCR Impact Factor：3.023,Q1)

[18]H.Y. Ye*, M. Mihailovic, C.K.Y. Wong, H.W. van Zeijl, A.W.J. Gielen, G.Q. Zhang, P.M. Sarro, Two-phase cooling of light emitting diode for higher light output and increased efficiency, Applied Thermal Engineering, 2012-12-27, Vo.52, Issue 2, pp. 353–9. (2012 JCR Impact Factor：2.127,Q1)